技术参数:
Housing: Hige Thermoplastic, UL94V-0,BLACK.
CAP: Hige Thermoplastic, UL94V-0,BLACK
Terminal: Selective Au On Contact Area,(See Order Information) 100u" MIN. Sn Plated ON Solder Tail Area, Both Over 50u" MIN. Ni Underplated Overall.
Board Lock: 100u" MIN.Sn Plated On Solder Tail Area, Both Over 50u" MIN. Ni Underplated Overall.